Epifine Epoxy Resin

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EpiFine Epoxy Adhesive

  • Finepolymers, a 100% owned by KISCO, is specializing in epoxy adhesive.
  • Finepolymers have Epoxy Modified division, and Semiconductor's Etching Residue Remover Division.
  • Epoxy Modified Division treats various resins that can be classified in to two:-
  • Component type resin, which is used for the sealing of electric relay. Resin used for the sealing of electric relay has many advantages, such as high viscosity, low out-gas essence, low temperature cure and storable at room temperature. Many Electric Relay manufacturers are using this resin.
  • Components type resin, which is used for sealing LED – mainly bullet type - has been widely used by manufacturers in Japan, Taiwan and Korea

Physical Properties of EpiFine epoxy resin..

  • Superior adhesive strength to various engineering plastics (PBT,LCP)
  • Keep strength even at high temperature. (250 degree Celsius)
  • Lower mis-curing by separation of epoxy and hardener
  • Lowering outgas that has bad effects on contacts.
  • Superior electric properties, especially superior tracking resistance property (C.T.I.)

Epoxy Resin (EpiFine)

In the field of power hybrid ICs, progress is being made every day in terms of miniaturization, higher degree of integration and higher power. These substrates require a higher degree of heat dissipation as well as higher reliability and processing power than their predecessors.

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Features

  • Good heat and chemical resistance
  • Good adhesive strength with engineering plastics (PBT, LCD etc.)
  • transporation and stock at room temperature, which lead to cost down
  • No organic gas generated during reaction
  • Controlled epoxy flow characters
  • low toxic for humans (reduce the risk of skin rash)
  • Over 560V for C.T.I value (IEC112)
about-image

Epoxy Resin (EpiFine)

In the field of power hybrid ICs, progress is being made every day in terms of miniaturization, higher degree of integration and higher power. These substrates require a higher degree of heat dissipation as well as higher reliability and processing power than their predecessors.

Features

  • Completely cured under low temperatur (800)
  • Low halogen
  • No organic gas generated during reaction
  • narrow the gap between devices
  • transporation and stock at room temperature, which lead to cost down
  • Controlled epoxy flow characters
  • No irritation in human body